SMPTE Journal ( Volume: 96, Issue: 2, February 1987)
[ACTIVE]
SMPTE Tutorial Paper: An Overview of Solid-State Sensor Technology
Metadata
- Publisher
- SMPTE — White Plains, NY, USA
- Doc Type
- Journal Article
- Content Type
- Original Research
- Abbreviated Title
- J SMPTE
- Volume
- 96, No. 2, pp. 180–185
- Abstract
- In a short time relative to the age of the television broadcasting industry, high-quality, affordable solid-state video cameras will become available for the broadcast/teleproduction industry. The new solid-state devices in such cameras will overcome two long-standing operational shortcomings of tube-type cameras: their susceptibility to external vibration and their loss of resolution when there is relative motion between camera and scene. Advances in semiconductor device technology, including new capabilities for concealing imperfect pixels, will make this possible. The new technology and techniques are reviewed.
- Publication Date
- 1987-02-01
- DOI
10.5594/J04007- ISSN
- Print:
0036-1682 - Link
- https://doi.org/10.5594/J04007
- Author(s)
- Koichi SadashigeBerlin, N.J
- Copyright
- © 1987 Society of Motion Picture and Television Engineers, Inc.
Bibliographic Reference(s)
- Television Camera Tubes and Solid-State Sensors for Broadcast Applications [Active]
- SMPTE Tutorial Paper: Resolution Considerations in Using CCD Imagers in Broadcast-Quality Cameras [Active]
- Earlier Proposals and Attempts . EXTERNAL
- Sequin C. H. , “Interlacing in Charge-Coupled Imaging Devices,” IEEE Electron Devices , 20 : 553 – 541 , June 1973 . EXTERNAL
- Sequin C. H. , “Charge-Coupled Area Image Sensor Using Three Levels of Polysilicon,” IEEE Electron Devices , 21 : 712 – 720 , Nov. 1974 . EXTERNAL
- Sequin C. H. , “All Solid-State Camera for the 525-line Television Format,” IEEE Solid-State Circuits , 11 : 115 – 121 , Feb. 1976 . EXTERNAL
- Dillon P. L. P. , “Color Imaging System Using a Single CCD Area Array,” IEEE Solid-State Circuits , 13 : 28 – 33 , Feb. 1978 . EXTERNAL
- Sei H. , “A Meander Channel CCD Linear Image Sensor,” IEEE Solid-State Circuits , pp. 66 – 70 . EXTERNAL
- Charge Injection Devices . EXTERNAL
- Burke H. K. Michon G. J. , “Charge-Injection Imaging: Operating Techniques and Performances Characteristics,” IEEE Solid-State Circuits , 11 : 121 – 127 , Feb. 1976 . EXTERNAL
- Barbe D. F. , “Charge-Coupled Devices and Charge-Injection Devices Imaging,” Op. cit., pp. 109 – 114 . EXTERNAL
- Brown D. M. , “Transparent Metal Oxide Electrode CID Images,” IEEE Solid-State Circuits , 11 : 128 – 132 , Feb. 1978 . EXTERNAL
- Brown D. M. , “High Density CID Imagers,” Op. cit., pp. 5 – 10 . EXTERNAL
- Schuster M. A. Strull G. , “A Monolithic Mosaic of Photo Sensors for Solid State Imaging Applications,” IEEE Electron Devices , 13 : 907 – 912 , Dec. 1966 . EXTERNAL
- Anagrostopoulos C. , “Signal Readout in CID Image Sensors,” Op. cit., pp. 11 – 15 . EXTERNAL
- Charge Priming Devices . EXTERNAL
- Fujiwara Y. Takamura H. , “Solid-State Imaging Technique,” Broadcast Engineering (text in Japanese) , pp. 737 – 743 , Sept. 1980 . EXTERNAL
- Matsushita Semi-Conductor Application Note , CPD Solid-State Imaging Device, MN-8201SW, Feb. 1983 . EXTERNAL
- Recent Developments . EXTERNAL
- Sato K. , “New Solid-State Television Cameras,” J. Inst. Eng. Japan (text in Japanese) , 37 : 104 – 111 , Feb. 1983 . EXTERNAL
- Chikamura T. , “A High-Sensitivity Solid-State Image Sensor using a Thin Film ZnSe — Znl-x Cd X Te Heterojunction Photosensor,” IEEE Electron Devices , 29 : 999 – 1003 , June 1982 . EXTERNAL
- Mitsui M. , “New NEC 3-Chip CCD Color Camera,” Broadcast Engineering , pp. 286 – 294 , Apr. 1984 . EXTERNAL
- Lewis R. , “Solid-State Cameras,” Electronic Imaging , 4 : 44 – 52 , Jan. 1985 . EXTERNAL
- Weimer P. K. , “Multi-Element Self-Scanned Mosaic Sensors,” IEEE Spectrum , 6 : 52 – 66 , Jan. 1969 . EXTERNAL
- Wakui K. , “Solid-State Imaging Device Applications for Color Cameras,” Broadcast Engineering , (in Japanese), pp. 709 – 716 , Sept. 1980 . EXTERNAL
- WESCON Technical Papers , Vol. 77, Part 7, Session 13, Aug. 1967 . EXTERNAL
- Charge-Coupled Devices . EXTERNAL
- Sangster F. L. J. Teer K. , “Bucket Brigade Electronics — New Possibilities for Delay, Time-Axis Conversion and Scanning,” IEEE Solid-State Circuits , SC-4 , No. 3 , June 1969 . EXTERNAL
- Boyle W. S. Smith G. E. , “Charge Coupled Semiconductor Devices,” Bell Systems Tech. J. , 49 : 587 – 593 , April 1970 . EXTERNAL
- Tompsett M. F. , “Charge Coupled Imaging Devices,” IEEE Electron Devices , 18 : 992 – 996 , Nov. 1971 . EXTERNAL
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Koichi Sadashige; SMPTE Tutorial Paper: An Overview of Solid-State Sensor Technology, SMPTE Journal ( Volume: 96, Issue: 2, February 1987); SMPTE, 1987. Available at https://doi.org/10.5594/J04007
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Koichi Sadashige; SMPTE Tutorial Paper: An Overview of Solid-State Sensor Technology, SMPTE Journal ( Volume: 96, Issue: 2, February 1987); SMPTE, 1987. Available at https://doi.org/10.5594/J04007
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Koichi Sadashige; SMPTE Tutorial Paper: An Overview of Solid-State Sensor Technology, SMPTE Journal ( Volume: 96, Issue: 2, February 1987); SMPTE, 1987. Available at https://doi.org/10.5594/J04007
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<span class="citation">Koichi Sadashige; <cite>SMPTE Tutorial Paper: An Overview of Solid-State Sensor Technology</cite>, SMPTE Journal ( Volume: 96, Issue: 2, February 1987); SMPTE, 1987. Available at <a href="https://doi.org/10.5594/J04007" target="_blank" rel="noopener">https://doi.org/10.5594/J04007</a></span>
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Koichi Sadashige; SMPTE Tutorial Paper: An Overview of Solid-State Sensor Technology, SMPTE Journal ( Volume: 96, Issue: 2, February 1987); SMPTE, 1987
doi: 10.5594/J04007
url: https://doi.org/10.5594/J04007
doi: 10.5594/J04007
url: https://doi.org/10.5594/J04007
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<li> Koichi Sadashige; <cite id="bib-10-5594-j04007">SMPTE Tutorial Paper: An Overview of Solid-State Sensor Technology</cite>, SMPTE Journal ( Volume: 96, Issue: 2, February 1987); SMPTE, 1987 <span class="doi">10.5594/J04007</span> </li>