Current document root:
SMPTE Journal ( Volume: 96, Issue: 2, February 1987)
SMPTE Tutorial Paper: An Overview of Solid-State Sensor Technology
SMPTE • Journal Article • [Active]
Click a document below to open its own reference tree.
Referenced By
Docs that depend on SMPTE Tutorial Paper: An Overview of Solid-State Sensor Technology
View:
·
Tree:
·
Level 1 — direct dependents (docs that cite this doc)
References Of
Docs that SMPTE Tutorial Paper: An Overview of Solid-State Sensor Technology depend on
View:
·
Tree:
·
Level 1 — direct references (docs this doc cites)
- Television Camera Tubes and Solid-State Sensors for Broadcast Applications[Active]
- SMPTE Tutorial Paper: Resolution Considerations in Using CCD Imagers in Broadcast-Quality Cameras[Active]
- Earlier Proposals and Attempts .EXTERNAL
- Sequin C. H. , “Interlacing in Charge-Coupled Imaging Devices,” IEEE Electron Devices , 20 : 553 – 541 , June 1973 .EXTERNAL
- Sequin C. H. , “Charge-Coupled Area Image Sensor Using Three Levels of Polysilicon,” IEEE Electron Devices , 21 : 712 – 720 , Nov. 1974 .EXTERNAL
- Sequin C. H. , “All Solid-State Camera for the 525-line Television Format,” IEEE Solid-State Circuits , 11 : 115 – 121 , Feb. 1976 .EXTERNAL
- Dillon P. L. P. , “Color Imaging System Using a Single CCD Area Array,” IEEE Solid-State Circuits , 13 : 28 – 33 , Feb. 1978 .EXTERNAL
- Sei H. , “A Meander Channel CCD Linear Image Sensor,” IEEE Solid-State Circuits , pp. 66 – 70 .EXTERNAL
- Charge Injection Devices .EXTERNAL
- Burke H. K. Michon G. J. , “Charge-Injection Imaging: Operating Techniques and Performances Characteristics,” IEEE Solid-State Circuits , 11 : 121 – 127 , Feb. 1976 .EXTERNAL
- Barbe D. F. , “Charge-Coupled Devices and Charge-Injection Devices Imaging,” Op. cit., pp. 109 – 114 .EXTERNAL
- Brown D. M. , “Transparent Metal Oxide Electrode CID Images,” IEEE Solid-State Circuits , 11 : 128 – 132 , Feb. 1978 .EXTERNAL
- Brown D. M. , “High Density CID Imagers,” Op. cit., pp. 5 – 10 .EXTERNAL
- Schuster M. A. Strull G. , “A Monolithic Mosaic of Photo Sensors for Solid State Imaging Applications,” IEEE Electron Devices , 13 : 907 – 912 , Dec. 1966 .EXTERNAL
- Anagrostopoulos C. , “Signal Readout in CID Image Sensors,” Op. cit., pp. 11 – 15 .EXTERNAL
- Charge Priming Devices .EXTERNAL
- Fujiwara Y. Takamura H. , “Solid-State Imaging Technique,” Broadcast Engineering (text in Japanese) , pp. 737 – 743 , Sept. 1980 .EXTERNAL
- Matsushita Semi-Conductor Application Note , CPD Solid-State Imaging Device, MN-8201SW, Feb. 1983 .EXTERNAL
- Recent Developments .EXTERNAL
- Sato K. , “New Solid-State Television Cameras,” J. Inst. Eng. Japan (text in Japanese) , 37 : 104 – 111 , Feb. 1983 .EXTERNAL
- Chikamura T. , “A High-Sensitivity Solid-State Image Sensor using a Thin Film ZnSe — Znl-x Cd X Te Heterojunction Photosensor,” IEEE Electron Devices , 29 : 999 – 1003 , June 1982 .EXTERNAL
- Mitsui M. , “New NEC 3-Chip CCD Color Camera,” Broadcast Engineering , pp. 286 – 294 , Apr. 1984 .EXTERNAL
- Lewis R. , “Solid-State Cameras,” Electronic Imaging , 4 : 44 – 52 , Jan. 1985 .EXTERNAL
- Weimer P. K. , “Multi-Element Self-Scanned Mosaic Sensors,” IEEE Spectrum , 6 : 52 – 66 , Jan. 1969 .EXTERNAL
- Wakui K. , “Solid-State Imaging Device Applications for Color Cameras,” Broadcast Engineering , (in Japanese), pp. 709 – 716 , Sept. 1980 .EXTERNAL
- WESCON Technical Papers , Vol. 77, Part 7, Session 13, Aug. 1967 .EXTERNAL
- Charge-Coupled Devices .EXTERNAL
- Sangster F. L. J. Teer K. , “Bucket Brigade Electronics — New Possibilities for Delay, Time-Axis Conversion and Scanning,” IEEE Solid-State Circuits , SC-4 , No. 3 , June 1969 .EXTERNAL
- Boyle W. S. Smith G. E. , “Charge Coupled Semiconductor Devices,” Bell Systems Tech. J. , 49 : 587 – 593 , April 1970 .EXTERNAL
- Tompsett M. F. , “Charge Coupled Imaging Devices,” IEEE Electron Devices , 18 : 992 – 996 , Nov. 1971 .EXTERNAL