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Current document root: SMPTE Journal ( Volume: 87, Issue: 4, April 1978)

An Experimental Telecine Using a Line-Array CCD Sensor

SMPTE • Journal Article • [Active]

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  • 1. Wright D. T. , “Solid-State Sensors: The Use of a Single Dimension 512-Element Array for Film Scanning,” BBC Research Dept. Report No. 1973/32.EXTERNAL
  • 10. Esser L. J. M. , “The Peristaltic Charge-Coupled Device,” Proceedings of the Charge-Coupled-Device Applications Conference, San Diego, 1973 , pp. 269 – 277 .EXTERNAL
  • 11. Le Couteur G. M. , “Sampling Frequencies and Structures for Solid-State Image Sensing in Broadcasting,” BBC Research Dept. Report in course of preparation.EXTERNAL
  • 12. Oliphant A. , “A Digital Telecine Processing Channel,” BBC Research Dept. Report in course of preparation.EXTERNAL
  • 13. Le Couteur G. M. , “Performance Tests on a Selection of 100-Element Charge-Coupled Devices,” BBC Research Dept. Report No. 1976/23.EXTERNAL
  • 14. Brown D. M. Ghezzo M. Garfinkel M. , “Transparent Metal Oxide Electrode CID Imager,” IEEE Journal Solid-State Circuits , pp. 128 – 132 , 1976 .EXTERNAL
  • 2. Le Couteur G. M. , “Solid-State Image Sensors: Improvements in Signal Processing Techniques,” BBC Research Dept. Report No. 1976/4.EXTERNAL
  • 3. Boyle W. S. Smith G. E. , “Charge-Coupled Semiconductor Devices,” Bell Syst. Tech. J. , 49 : 587 – 593 , 1970 .EXTERNAL
  • 4. Amelio G. F. Bertram W. J. Jr. Tompsett M. F. , “Charge-Coupled Imaging Devices: Design Considerations,” IEEE Trans. Electron Devices , Vol. ED-18 , No. 11 , 986 – 992 , 1971 .EXTERNAL
  • 5. Amelio G. F. , “The Impact of Large CCD Image Sensing Area Arrays, CCD-74,” International Conference on Technology and Applications of Charged-Coupled Devices, Edinburgh, Scotland. September 1974 .EXTERNAL
  • 6. Sequin C. H. Tompsett M. F. , Charge Transfer Devices, Supplement 8 to Advances in Electronics and Electron Physics , Academic Press , New York , 1975 .EXTERNAL
  • 7. Kosonocky W. F. Carnes J. E. , “Two-Phase Charge-Coupled Shift Registers,” 1972 IEEE International Solid-State Circuits Conference Digest, p. 132 , IEEE , New York .EXTERNAL
  • 8. Krambeck R. H. Walden R. H. Pickar K. A. , “Implanted Barrier Two-Phase Charge-Coupled Device,” Applied Phys. Letts , Vol. 19 , No. 12 , pp. 520 – 522 , 1971 .EXTERNAL
  • 9. Walden R. H. , “The Buried-Channel Charge-Coupled Device,” Bell Syst. Tech. J. , Vol. 51 , No. 7 , pp. 1635 – 1640 , 1972 .EXTERNAL