SMPTE Journal ( Volume: 96, Issue: 12, December 1987)
[ACTIVE]
Technical Note: High-Density Solid-State Image Sensor
Metadata
- Publisher
- SMPTE — White Plains, NY, USA
- Doc Type
- Journal Article
- Content Type
- Original Research
- Abbreviated Title
- J SMPTE
- Volume
- 96, No. 12, pp. 1186–1188
- Abstract
- A full-frame CCD sensor capable of imaging 1.4 megapixels has been developed for industrial and scientific applications. This sensor, used in an advanced camera developed by Eastman Kodak Co., has almost six times as many pixels as other sensors in advanced video cameras. The design and performance of the sensor are described, as well as features of the camera.
- Publication Date
- 1987-12-01
- DOI
10.5594/J02992- ISSN
- Print:
0036-1682 - Link
- https://doi.org/10.5594/J02992
- Author(s)
- W. C. ChangEastman Kodak Co., Rochester, NY 14650.T. J. TredwellEastman Kodak Co., Rochester, NY 14650.E. G. StevensEastman Kodak Co., Rochester, NY 14650.D. N. NicholsEastman Kodak Co., Rochester, NY 14650.
- Copyright
- © 1987 Society of Motion Picture and Television Engineers, Inc.
Bibliographic Reference(s)
- 1. Krambeck R. H. Walden R. H. Pickar K. A. , “Implanted-Barrier Two-Phase Charge-Coupled Devices.” Appl. Phys. Lett. 19 , 520 – 22 , 1971 . EXTERNAL
- 2. Erb D. M. , “An Overlapping Electrode Buried Channel CCD,” IEDM Tech. Digest. 24 – 26 . Dec. 1973 . EXTERNAL
- 3. Van der Ziel A. , “Alternative Explanation of 1/f Noise in Ion-Implanted MOSFETs,” Solid-State Electron. , 29 : 927 – 28 , 1983 . EXTERNAL
- 4. Aoki M. Sakai Y. Masubara T. , “Low 1/f Noise Design of Hi-CMOS Devices,” IEEE Trans. Electron Devices , ED-29 : 296 – 99 , 1982 . EXTERNAL
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W. C. Chang, T. J. Tredwell, E. G. Stevens, and D. N. Nichols; Technical Note: High-Density Solid-State Image Sensor, SMPTE Journal ( Volume: 96, Issue: 12, December 1987); SMPTE, 1987. Available at https://doi.org/10.5594/J02992
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W. C. Chang, T. J. Tredwell, E. G. Stevens, and D. N. Nichols; Technical Note: High-Density Solid-State Image Sensor, SMPTE Journal ( Volume: 96, Issue: 12, December 1987); SMPTE, 1987. Available at https://doi.org/10.5594/J02992
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W. C. Chang, T. J. Tredwell, E. G. Stevens, and D. N. Nichols; Technical Note: High-Density Solid-State Image Sensor, SMPTE Journal ( Volume: 96, Issue: 12, December 1987); SMPTE, 1987. Available at https://doi.org/10.5594/J02992
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<span class="citation">W. C. Chang, T. J. Tredwell, E. G. Stevens, and D. N. Nichols; <cite>Technical Note: High-Density Solid-State Image Sensor</cite>, SMPTE Journal ( Volume: 96, Issue: 12, December 1987); SMPTE, 1987. Available at <a href="https://doi.org/10.5594/J02992" target="_blank" rel="noopener">https://doi.org/10.5594/J02992</a></span>
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W. C. Chang, T. J. Tredwell, E. G. Stevens, and D. N. Nichols; Technical Note: High-Density Solid-State Image Sensor, SMPTE Journal ( Volume: 96, Issue: 12, December 1987); SMPTE, 1987
doi: 10.5594/J02992
url: https://doi.org/10.5594/J02992
doi: 10.5594/J02992
url: https://doi.org/10.5594/J02992
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<li> W. C. Chang, T. J. Tredwell, E. G. Stevens, and D. N. Nichols; <cite id="bib-10-5594-j02992">Technical Note: High-Density Solid-State Image Sensor</cite>, SMPTE Journal ( Volume: 96, Issue: 12, December 1987); SMPTE, 1987 <span class="doi">10.5594/J02992</span> </li>