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    "abstract": "Currently there are proposals before both SMPTE and the ITU for a 2.97Gb/s SDI interface using 75Ω coax cable and BNC connectors. The interest in these interfaces is driven by a desire to be able to transport 1080 line progressive formats video over a single link, rather than the dual link interfaces currently used. The implementation of this interface with existing infrastructure components such as patch panels, connectors, coax cable types, etc. has been studied, and key components have been realized in silicon. The results of this work will be discussed in this paper.",
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    "authors": [
      {
        "affiliation": "Gennum Corporation",
        "name": "Mark Sauerwald"
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      {
        "affiliation": "Gennum Corporation",
        "name": "John Hudson"
      },
      {
        "affiliation": "Gennum Corporation",
        "name": "Vasilis Papanikolaou"
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      {
        "affiliation": "Gennum Corporation",
        "name": "Rakesh Patel"
      }
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    "docTitle": "3G: The Evolution of SDI",
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